
Advances in AI and high-frequency communication are boosting demand for large, multi-layer PCBs and high-speed CCLs, thereby increasing the need for high-performance electronic glass fabrics such as low-dielectric and low-CTE types.
TrendForce forecasts global AI server shipments will grow from 1.18 million units in 2023 to 2.37 million by 2026, with a CAGR exceeding 25%. Meanwhile, 6G terminal connections are projected to increase 30-fold by 2040, with data traffic rising over 130 times.
This expansion in high-frequency communication and AI infrastructure is creating significant opportunities for advanced electronic glass fabrics, leading many manufacturers to ramp up production.