Build a stronger, more competitive product with our value.
Build a stronger, more competitive product with our value.
Build a stronger, more competitive product with our value.
Build a stronger, more competitive product with our value.
Build a stronger, more competitive product with our value.
Build a stronger, more competitive product with our value.
Build a stronger, more competitive product with our value.
Build a stronger, more competitive product with our value.
Build a stronger, more competitive product with our value.
Build a stronger, more competitive product with our value.
A major breakthrough has recently been made in the field of advanced semiconductor packaging. Absolics, a subsidiary of SKC, is expected to launch the world’s first commercial mass production line for semiconductor glass substrates by the end of this year, marking a brand-new upgrade in the packaging material track.
Compared with traditional organic substrates, glass substrates feature low dielectric loss and high stability, meeting the high-frequency and high-bandwidth requirements of high-end chips. Currently, product performance verification has been completed and yield ramp-up is in progress, with prototypes being tested by leading enterprises including AMD and AWS. The company is also expanding its non-embedded glass substrate business for 5G/6G communications, which is expected to further accelerate the commercialization of the industry.
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